🔷Peltier Cooling Module Product Drawing

🔷Peltier Effect CoolerPeltiers Basic Performance Spec

🔷Cooler with Peltier Additional Performance Spec

🔷Peltier Device Cooler Performance Curve

🔷Peltier Module Cooler Product Overview

The TEC1-19506 is a top-of-the-line flagship semiconductor cooling module designed for cooling extremely large areas at extreme power densities. Measuring 30 × 60 mm, it features a large, rectangular, symmetrical package design that provides an exceptionally generous heat exchange area. Optimized for applications requiring massive surface-area temperature control and extremely high thermal loads—such as extreme-power industrial laser modules, large-scale high-power industrial equipment, and high-performance medical devices—it is the most powerful flagship model in the series.

This product is available in three crystal configurations—K10, K12, and K14—with thicknesses of 3.4 mm, 3.6 mm, and 3.8 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 24.0 V, a maximum current of 6.0 A, a maximum cooling power of 144 W, and an internal resistance of just 3.12 Ω.

The extra-large 30×60 mm rectangular package allows it to be embedded inside high-power laser modules, large industrial equipment, and other applications—while ensuring a maximum cooling temperature difference of 70°C and cooling for 144W of peak power, the 30 mm width and 60 mm length provide an extremely generous heat exchange area, helping to evenly distribute cooling to the surface of very large loads. This product features a 24V high-voltage, 6.0A current drive design, making it highly compatible with common industrial power supplies (24V) and telecommunications equipment power platforms. The low internal resistance of 3.12Ω effectively controls Joule heat loss (I²R ≈ 112.3W) at 6.0A, allowing more electrical energy to be converted into effective cooling capacity and delivering outstanding energy efficiency. The substrate utilizes a sintered process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper; the relatively thick copper layer ensures uniform heat dissipation across the 60 mm × 30 mm large surface area. It comes standard with 20 AWG silicone rubber leads (200 mm in length), capable of safely carrying a 6.0 A current. The 704 is sealed around the perimeter with silicone rubber, providing excellent moisture, dust, and shock resistance. Its all-solid-state construction ensures precise operation with zero noise and zero vibration.

This product is typically used in applications such as temperature control for high-power industrial laser modules, heat dissipation for large-scale industrial equipment, high-performance medical devices, and high-power communication base stations. It is the premier flagship choice for cooling applications requiring extreme power density over very large surface areas.

🔷Peltiers Product Applications

1. Temperature Control for High-Power Industrial Laser Modules

High-power industrial semiconductor laser modules generate significant heat during operation. The TEC1-19506’s 144W peak cooling capacity enables efficient temperature control across an extra-large 30×60mm area, stabilizing the laser temperature within ±0.05°C of the setpoint. It is suitable for high-power laser processing, optical communications, and LIDAR systems.

2. Heat Dissipation for Large Industrial Equipment

High-power electronic components and power modules in large industrial equipment generate concentrated heat during operation. The TEC1-19506 can be mounted directly on the component surface; its 144W peak cooling capacity provides robust active cooling, reducing core temperatures by more than 25°C and enhancing equipment reliability and lifespan.

3. Temperature Control for High-Performance Medical Equipment

High-end medical imaging equipment and large in-vitro diagnostic devices require a strictly controlled, constant-temperature environment. The TEC1-19506 delivers robust cooling performance thanks to its large coverage area, maintenance-free operation, and stable performance.

4. Heat Dissipation for High-Power Communication Base Stations

High-power communication devices, such as 5G base stations and high-power transmitters, generate concentrated heat. The TEC1-19506 can be used for active cooling, and its 24.0V operating voltage is fully compatible with communication equipment power platforms.

🔷Thermoelectric Peltier Device Installation and Usage Recommendations

Assembly Pressure: Recommended 4.5 kg (0.25 kg/cm²). It is recommended to apply high-performance thermal grease (thermal conductivity > 5 W/m·K) evenly to both surfaces.

Hot-End Cooling Requirements (Critical): With a power consumption of 144 W, heat generation is extremely high. We recommend using a large extruded aluminum heatsink measuring at least 40 × 70 × 50 mm, paired with a high-airflow fan (airflow > 35 CFM), or implementing a water-cooling solution to ensure timely heat dissipation from the hot end. The cooling efficiency of the hot end directly determines the lowest achievable temperature at the cold end.

Power Supply Requirements: Maximum voltage 24.0 V, maximum current 6.0 A. A regulated power supply rated at 24 V/7 A or higher is recommended. Power supply ripple < 50 mV.

Lead Wires: Standard configuration includes 20 AWG silicone-insulated wires (200 mm in length), rated for a safe current carrying capacity of 6.0 A.

Current Limit: Must not exceed 6.0A; it is recommended to connect a 7A self-resetting fuse in series.

Storage Conditions: Temperature < 120°C, humidity < 60% Rh.

Maximum Temperature: Must not exceed 138°C; soldering temperature < 280°C, duration < 5 seconds.