The TEC1-09908 is a flagship semiconductor cooling module designed for cooling extremely large areas and achieving extreme high power density. Measuring 30 × 60 mm, it features a large, rectangular, symmetrical package design that provides an exceptionally generous heat exchange area. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
🔷Thermoelectric Cooling Devices Product Drawing

🔷Peltier Elements Basic Performance Spec
| Type Mode | Chip Model | ΔTmax (°C) | ACR (Ω) | Umax (V) | Imax (A) | Pmax (W) | Size (mm) |
|---|---|---|---|---|---|---|---|
| TEC1-09908 | K10 | 60 | 1.17 | 12.0 | 8.0 | 96 | 30×60×3.4 |
| TEC1-09908 | K14 | 65 | 1.17 | 12.0 | 8.0 | 96 | 30×60×3.8 |
| TEC1-09908 | K18 | 70 | 1.17 | 12.0 | 8.0 | 96 | 30×60×4.2 |
🔷Thermoelectric Controller Additional Performance Spec
| Parameter | Specification |
|---|---|
| Substrate Material | 96% alumina (0.76 mm) + oxygen-free copper (0.4 mm), sintered process |
| Lead Wire Specification | Silicone wire, 18 AWG, L = 200 mm |
| Terminal Specification | Not included as standard; available upon request |
| Assembly Pressure | 4.5 kg (0.25 kg/cm²) |
| Packaging Standard | Polystyrene (PS) foam box |
| Sealant Material | 704 silicone rubber sealant |
| Maximum Temperature Resistance | Bismuth-tin eco-friendly solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60% Rh |
🔷Thermal Generators Performance Curve

🔷Thermoelectric Devices Product Overview
The TEC1-09908 is a flagship semiconductor cooling module designed for cooling extremely large areas and achieving extreme high power density. Measuring 30 × 60 mm, it features a large, rectangular, symmetrical package design that provides an exceptionally generous heat exchange area. Optimized for applications requiring massive surface-area temperature control and extremely high thermal loads—such as ultra-high-power industrial laser modules, large-scale high-power industrial equipment, and high-performance medical devices—it is the most powerful flagship model in the series.
This product is available in three crystal configurations—K10, K14, and K18—with thicknesses of 3.4 mm, 3.8 mm, and 4.2 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 12.0 V, a maximum current of 8.0 A, a maximum cooling power of 96 W, and an internal resistance of just 1.17 Ω.
The extra-large 30×60mm rectangular package allows it to be embedded inside extreme ultra-high-power laser modules, large industrial equipment, and similar applications—while ensuring a maximum cooling temperature difference of 70°C and extreme ultra-high-power cooling of 96W, the 30mm width and 60mm length provide an extremely generous heat exchange area, helping to evenly distribute cooling to the surface of very large loads. This product is designed to operate at 12.0 V and 8.0 A, making it highly compatible with common industrial power supplies (12 V) and telecommunications equipment power platforms. With an ultra-low internal resistance of 1.17Ω—the lowest in this series—Joule heat loss (I²R ≈ 74.9W) at a high current of 8.0A is effectively controlled, allowing more electrical energy to be converted into effective cooling capacity and delivering outstanding energy efficiency. The substrate utilizes a sintering process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper, ensuring uniform heat dissipation across the 60 mm × 30 mm ultra-large surface area. It comes standard with 18 AWG silicone-coated leads (200 mm in length), capable of safely handling the 8.0 A high current. Sealed with 704 silicone rubber around the perimeter, it operates in a fully solid-state, noise-free, and vibration-free manner, ensuring stable and reliable performance.
This product is typically used in applications such as temperature control for extreme ultra-high-power industrial laser modules, heat dissipation for large-scale industrial equipment, high-performance medical devices, and high-power communication base stations. It is the premier flagship choice for extreme ultra-high-power-density cooling requirements in ultra-large-area spaces.
🔷Peltier Element Cooler Product Features
1. Extra-large, symmetrical design with ample heat exchange area
The extra-large 30×60 mm rectangular package provides an extremely generous heat exchange area, making it ideal for large, extreme-high-power temperature-controlled equipment.
2. Extreme-high-power cooling with top-tier performance
With a maximum current of 8.0 A and a maximum power of 96 W, it achieves top-tier power density cooling within its large-area package, making it the most powerful flagship model in the series.
3. Deep cooling capability with a large temperature difference across a vast surface area
It achieves a maximum temperature difference of 70°C at the extreme ultra-high power of 96 W, with the cold end reaching as low as approximately -30°C.
4. Three Chip Options for Flexible Adaptability
Offers three chip configurations: K10 (60°C), K14 (65°C), and K18 (70°C).
5. Ultra-Low Internal Resistance Design for Efficient Power Conversion
With an internal resistance of just 1.17 Ω, this is the model with the lowest internal resistance in the series. At a high current of 8.0 A, Joule heating losses are effectively controlled, allowing more electrical energy to be converted into effective cooling capacity.
6. Ultra-Thin Design, Saves Vertical Space
With a thickness of only 3.4–4.2 mm, it maintains an excellent slim-profile design among extreme ultra-high-power models.
7. Excellent Power Supply Compatibility
With a maximum voltage of 12.0V, it is highly compatible with common industrial power supplies (12V), telecommunications equipment power supplies, and other platforms.
8. High-Quality Substrate with Superior Heat Dissipation Across an Extra-Large Area
A thick copper layer ensures uniform heat distribution and efficient heat dissipation across an extra-large area of 60 mm × 30 mm.
9. Extra-Thick, Long Leads for Safe 8.0A Current Carrying Capacity
Comes standard with 18 AWG silicone-coated wire (200 mm long), meeting the demands of extreme high-current transmission and large-scale equipment wiring.
10. High Adaptability to Assembly Pressure
Recommended assembly pressure of 4.5 kg (0.25 kg/cm²), ensuring tight contact with the large-area heat sink.
11. Sealed Protection, Strong Environmental Adaptability
The 704 silicone rubber seal provides excellent moisture, dust, and shock resistance.
12. Bidirectional Temperature Control, Dual-Function Single Core
Reversing the current polarity activates heating mode, enabling bidirectional temperature regulation.
13. Zero Noise, Zero Vibration, Precision Operation
Fully solid-state construction ensures completely silent and vibration-free operation.
🔷Thermoelectric Generator Product Structure

The TEC1-19504 is a flagship semiconductor cooling module designed for cooling applications requiring extremely large surface areas, ultra-high power, and high voltage density. measuring 30 × 60 mm. Featuring a large, rectangular, symmetrical package design, it provides an exceptionally generous heat exchange area and is optimized for equipment requiring extensive temperature control and handling extremely high thermal loads—such as ultra-high-power industrial laser modules, large-scale high-power industrial equipment, and high-performance medical devices. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
The TEC1-19503 is a semiconductor cooling module designed for precision temperature control of extremely large areas, high power, and high voltage. With dimensions of 30 × 60 mm, it features a large, rectangular, symmetrical package design that provides an exceptionally generous heat exchange area. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
The TEC1-19502 is a semiconductor cooling module designed for high-precision temperature control of large-area, medium-power, high-voltage applications. With dimensions of 30 × 60 mm, it features a large, rectangular, symmetrical package design that provides an exceptionally generous heat exchange area. It is optimized for industrial-grade laser modules, large medical and cosmetic devices, industrial analytical instruments, communication base stations, and other equipment requiring temperature control over a very large area with moderate power. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
The TEC1-19501 is a semiconductor cooling module designed for ultra-large-area, high-voltage, ultra-low-power precision temperature control. With dimensions of 30 × 60 mm, it features a large, rectangular, symmetrical package design that provides an exceptionally generous heat exchange area. It is specifically optimized for industrial-grade laser modules, large medical and cosmetic devices, industrial analytical instruments, and communication base stations—all of which require temperature control over an extremely large area while operating within extremely tight power consumption budgets. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
The TEC1-09912 is a top-of-the-line flagship semiconductor cooling module designed for cooling extremely large areas at extreme power densities. Measuring 30 × 60 mm, it features a large, rectangular, symmetrical package design that provides an exceptionally generous heat exchange area. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw
The TEC1-09910 is a flagship semiconductor cooling module designed for extremely large areas and extreme ultra-high power density cooling. Measuring 30 × 60 mm, it features a large, rectangular, symmetrical package design that provides an exceptionally generous heat exchange area. 🟧 Price List Contact Customer Service 🟦 Certifications Contact Customer Service ⬜ Product PDF Spec Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw