🔷Thermoelectric Generation Product Drawing

🔷Thermoelectric Generator Modules Basic Performance Spec

🔷Thermo Cooler Additional Performance Spec

🔷Peltier Heater Performance Curve

🔷TEC Peltier Product Overview

The TEC1-09904 is a semiconductor cooling module designed for precision temperature control of extremely large areas with high power density. With dimensions of 30 × 60 mm, it features a large, rectangular, symmetrical package design that provides an exceptionally generous heat exchange area. It is optimized for equipment requiring temperature control over very large areas and handling high thermal loads, such as high-power industrial laser modules, large medical and cosmetic devices, industrial analytical instruments, and telecommunications base stations.

This product is available in three crystal configurations—K14, K26, and K38—with thicknesses of 3.8 mm, 5.0 mm, and 6.2 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under conditions where the hot-end temperature Th = 40°C). It features a maximum voltage of 12.0 V, a maximum current of 4.0 A, a maximum cooling power of 48 W, and an internal resistance of 2.34 Ω.

The extra-large 30×60mm rectangular package allows it to be embedded within large laser modules, medical devices, industrial equipment, and other applications. While ensuring a maximum cooling temperature difference of 70°C and high-power cooling of 48W, the 30mm width and 60mm length provide an extremely generous heat exchange area, helping to evenly distribute cooling capacity across the large surface area of the load. This product is designed to operate at 12.0V and 4.0A, making it highly compatible with common industrial power supplies (12V), telecommunications equipment power supplies, and automotive power platforms. The low internal resistance of 2.34Ω effectively controls Joule heating (I²R ≈ 37.4W) at 4.0A, allowing more electrical energy to be converted into effective cooling capacity. The substrate utilizes a sintered process combining 96% alumina ceramic (0.76 mm) and 0.4 mm oxygen-free copper; the relatively thick copper layer ensures uniform heat dissipation across the 60 mm × 30 mm large surface area. It comes standard with 22 AWG silicone-coated leads (100 mm in length), capable of safely carrying a 4.0 A current. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance. The all-solid-state design ensures precise operation with zero noise and zero vibration.

This product is typically used for temperature control in high-power, large-scale industrial laser modules; large medical and cosmetic equipment; temperature stabilization in industrial analytical instruments; heat dissipation for telecommunications base station equipment; industrial laser processing equipment; and large medical diagnostic equipment. It is the ideal choice for high-power-density, precision temperature control applications requiring coverage of very large areas.

🔷TEC Module Product Selection

🔷Thermoelectric Cooler Module Operation Principle

TEC1-09903 utilizes the Peltier effect to achieve thermoelectric cooling. At its core, multiple pairs of P-type (Bi₂Te₃-Sb₂Te₃ hole-type) and N-type (Bi₂Te₃-Bi₂Se₃ electron-type) semiconductor grains are connected in series via metal bus bars to form a thermoelectric stack, which is sandwiched between two layers of highly thermally conductive 96% alumina ceramic substrates. This model features 99 pairs of semiconductor grains (the “099” in the model number denotes 99 pairs), representing a large-scale thermopile design—with a higher number of thermocouple pairs, it can generate a larger temperature difference and cooling capacity at the same current, providing sufficient heat pump capacity for temperature control over an extra-large 60mm × 30mm area. The 0.4 mm thick oxygen-free copper layer ensures uniform heat diffusion across the 60 mm × 30 mm extra-large area.

When a forward DC voltage (maximum 12.0 V) is applied, a 3.0 A current drives holes in the P-type material and electrons in the N-type material to migrate in opposite directions. As the carriers cross the PN junction interface, the cold-end node absorbs lattice vibration energy (phonons), causing the temperature to drop, while the hot-end node releases energy, causing the temperature to rise. Under continuous electric field drive, heat is continuously “pumped” from the cold end to the hot end, achieving active cooling.

This product is designed to operate at 12.0V and 3.0A, making it highly compatible with common 12V industrial power supply platforms. It requires no additional step-up or step-down circuits, simplifying system power supply design. The 3.12Ω internal resistance keeps Joule heating (I²R ≈ 28.1W) within a reasonable range, allowing more electrical energy to be converted into effective cooling capacity. The 0.4mm-thick copper layer helps heat from the hot end diffuse uniformly across the 60mm × 30mm extra-large surface area, preventing localized overheating and improving heat dissipation efficiency.

At a hot-end temperature of 40°C, this product achieves a maximum temperature difference of 70°C (K40 model), meaning the cold end can reach as low as approximately -30°C. Achieving this level of deep cooling at an input power of 36W demonstrates balanced energy efficiency. The 30×60mm ultra-large surface area design allows it to fit snugly against oversized loads such as large laser modules and industrial equipment. The large contact area and short heat transfer path effectively reduce the contact thermal resistance between the cold end and the load.