🔷Thermoelectric Peltier Device Basic Performance Spec

🔷Peltier Device Basic Performance Spec

🔷Thermoelectric Module Additional Performance Spec

🔷Thermoelectric Peltier Performance Curve

🔷TEG Module Product Overview

The TEC1-07102 is a compact semiconductor cooling module with dimensions of 23 × 23 mm. It offers three crystal options—K16, K18, and K20—with thicknesses of 4.0 mm, 4.2 mm, and 4.4 mm, respectively, corresponding to maximum temperature differences of 50°C, 55°C, and 60°C, allowing for flexible adaptation to various cooling requirements. At Th=40°C, it features a maximum voltage of 8.4V, a maximum current of 2.2A, a maximum cooling power of 18W, and an internal resistance of 2.98Ω, delivering stable and consistent performance. The product utilizes a 96% alumina substrate and an oxygen-free copper sintering process, ensuring excellent thermal conductivity and reliable insulation. It is equipped with extra-soft silicone leads (26 AWG, L=100 mm) for easy wiring in confined spaces. Standard units do not include terminals, which can be added upon request. The recommended assembly pressure is 1.3 kg, and 704 silicone rubber is used for encapsulation to provide moisture resistance and shock resistance. It uses environmentally friendly bismuth-tin solder (melting point 138°C) and is suitable for applications such as precision temperature control, small analytical instruments, and optoelectronic device cooling. The recommended storage environment is a temperature below 120°C and humidity below 60% Rh.

🔷Solid State Cooler Product Features

1. Multiple Chip Options, Wide Temperature Difference Coverage

Three chip configurations are available: K14, K16, and K18, with maximum cooling temperature differences (ΔTmax) of 60°C, 62°C, and 64°C, respectively (at a hot-end temperature of Th=40°C). This allows for flexible selection based on different target temperatures and application scenarios, balancing performance and cost.

2. Ample Cooling Power and Rapid Response

With a maximum cooling power of 25 W, a maximum current of 3.0 A, a maximum voltage of 8.4 V, and an internal resistance of just 2.18 Ω, the device reaches a steady-state temperature difference within seconds of applying DC power. This enables fast and precise temperature response, meeting the demands of dynamic temperature control.

3. Compact Design, Suitable for Miniaturized Integration

With dimensions of just 23 × 23 mm and a thickness of 3.8–4.2 mm, this compact design is ideal for space-constrained portable devices, miniature instruments, and embedded systems. Three thickness options provide flexibility for mechanical mounting.

4. High-Efficiency Thermal Conductivity and Insulating Substrate

The substrate is manufactured using a sintering process that combines 96% aluminum oxide ceramic (0.76 mm) with oxygen-free copper (0.4 mm), offering both excellent electrical insulation (high dielectric strength) and thermal conductivity. This ensures rapid heat transfer while preventing the risk of electrical short circuits.

5. High-Quality Leads for Easy Wiring

Standard UL3132 silicone rubber leads (26 AWG, 100 mm in length) are included. The leads are flexible and temperature-resistant, with an aging-resistant insulation layer, facilitating bending and routing in confined spaces and reducing assembly complexity.

6. Standardized Packaging, Strong Environmental Adaptability

Features a 704 silicone rubber perimeter seal that effectively prevents moisture, dust, and vibration, protecting the internal thermoelectric grains from corrosion and enhancing long-term reliability in humid environments or those with extreme temperature fluctuations.

7. Eco-Friendly Manufacturing Process, Safe and Durable

Internal solder joints use eco-friendly bismuth-tin solder with a melting point of 138°C, compliant with RoHS standards. The solder joints are robust and thermally stable, eliminating the risk of solder joint failure at high temperatures.

8. Flexible Terminal Configuration, Customizable

Standard products do not include terminals, but they can be added upon user request to facilitate connection to different types of power supplies or control boards, improving the convenience of system integration.

9. Bidirectional Temperature Control Capability

By reversing the direction of the input current, the cooling and heating sides can be interchanged, supporting bidirectional temperature control for both cooling and heating. This makes it suitable for applications requiring forward and reverse regulation, such as precision constant-temperature cycling and bioreactor temperature control.

10. Proven Assembly Specifications, High Reliability

The recommended assembly pressure is 1.3 kg (0.25 kg/cm²), ensuring tight contact between the cooling plate and the heat sink or temperature-controlled surface, reducing contact thermal resistance, and guaranteeing optimal performance.