🔷Element Peltier Product Drawing

🔷Peltier Cooling Element Basic Performance Spec

🔷TEC Cooling System Additional Performance Spec

🔷Thermoelectric Cooling Device Performance Curve

🔷Thermoelectric Cooling Element Product Overview

The TEC1-03102 is a miniature semiconductor cooling module designed for ultra-low-power, ultra-compact precision temperature control. With dimensions of just 12×12 mm, it is one of the smallest semiconductor cooling modules currently available on the market and is specifically designed for ultra-portable devices, micro-sensors, and precision optical modules where space is extremely limited.

This product is available in three chip configurations—K10, K16, and K22—with thicknesses of 3.0 mm, 3.2 mm, and 3.4 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). It operates at a maximum voltage of just 3.7V, a maximum current of 2.2A, a maximum cooling power of 8W, and an internal resistance of 1.31Ω.

Its ultra-compact 12×12mm package allows for easy integration into devices with extremely limited space, such as smartphone camera modules, micro-optical modules, wearable sensors, and endoscope probes. While maintaining exactly the same electrical parameters as the 15×15 mm version (3.7 V/2.2 A/8 W/70 °C), the package area has been reduced by 36% (from 225 mm² to 144 mm²), and the thickness has been reduced to 3.0–3.4 mm. This means that the same cooling capacity and deep cooling performance (temperature difference of up to 70°C) are packed into a smaller volume, further enhancing power density.

This product utilizes a 96% alumina ceramic substrate and a 0.2mm oxygen-free copper sintering process, achieving an ultra-lightweight design while ensuring excellent thermal conductivity and electrical insulation. It comes standard with 26 AWG silicone rubber leads, which are flexible and exert virtually no mechanical stress on the micro-chiller. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance, making it suitable for complex operating environments. The all-solid-state structure ensures precise operation with zero noise and zero vibration. Its low power consumption of 8W allows it to be powered directly by a single lithium battery without the need for a boost circuit, making it highly suitable for battery-powered portable and wearable devices and an ideal choice for ultra-micro temperature control applications.

🔷Thermoelectric Generation Product Applications

1. Ultra-compact design, one of the smallest on the market

With an ultra-small package size of 12×12 mm and a thickness of just 3.0–3.4 mm, it is one of the smallest semiconductor cooling chips currently available on the market and can be easily integrated into various ultra-compact devices.

2. Ultra-low power consumption for extended battery life

With a maximum current of just 2.2 A and a maximum power of only 8 W, it supports long periods of continuous operation when paired with a micro lithium-ion battery, making it ideal for battery-powered portable and wearable devices.

3. Ultra-Low Voltage Operation, Directly Powered by a Single Battery

With a maximum voltage of just 3.7V, it is directly compatible with a single lithium battery (3.0–4.2V), eliminating the need for any boost circuits. Power efficiency approaches 100%, resulting in the lowest system cost and smallest form factor.

4. Deep Cooling Capability with Wide Temperature Range

Achieves a maximum temperature difference of 70°C at an ultra-low power consumption of just 8W, with the cold end reaching as low as approximately -30°C, covering all application scenarios from conventional cooling to deep cooling.

5. Three Chip Options for Flexible Adaptation

Three chip configurations are available: K10 (60°C), K16 (65°C), and K22 (70°C). Users can flexibly select the appropriate model based on their target cooling depth and cost requirements.

6. Three thickness options to accommodate different spaces

Thicknesses of 3.0 mm, 3.2 mm, and 3.4 mm are available, allowing users to flexibly select the optimal fit based on vertical space constraints within the equipment.

7. High-Quality Substrate, Lightweight Design

The substrate is manufactured using a sintering process combining 96% alumina ceramic (0.76 mm) and oxygen-free copper (0.2 mm), resulting in an extremely lightweight overall structure with low thermal mass and rapid temperature response.

8. Fine-Gauge Leads for Ultimate Lightweight Design

Comes standard with 26 AWG silicone-coated wire (100 mm in length). With the thinnest gauge and extremely flexible wire body, it exerts virtually no stress on the cooling plate, making it suitable for micron-level precision assembly.

9. Sealed Protection, Strong Environmental Adaptability

The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance, enabling operation in complex environments with high humidity and significant temperature fluctuations.

10. Bidirectional Temperature Control, Dual-Function Single Core

Simply reversing the input current polarity activates heating mode, making it suitable for precision temperature control systems requiring bidirectional temperature regulation.

11. Zero Noise, Zero Vibration, Precision Operation

With an all-solid-state design and no moving parts, it operates completely silently and with zero vibration, making it suitable for high-precision applications with extreme requirements for noise and vibration.

🔷Thermoelectric Generator Modules Product Structure