🔷Thermo Cooler Product Drawing

🔷Peltier Heater Basic Performance Spec

🔷TEC Peltier Additional Performance Spec

🔷TEC Module Performance Curve

🔷Thermoelectric Cooler Module Product Overview

The TEC1-03101 is a flagship semiconductor cooling module designed for ultra-low power consumption, extreme miniaturization, and deep cooling. With dimensions of just 12×12 mm, it is one of the smallest high-performance semiconductor cooling modules currently available on the global market, specifically engineered for miniaturized, battery-powered, and ultra-low thermal load cutting-edge applications.

This product is available in three chip configurations—K10, K16, and K22—with thicknesses of 3.0 mm, 3.6 mm, and 4.2 mm, respectively, corresponding to maximum cooling temperature differences of 60°C, 65°C, and 70°C (under a hot-end temperature of Th=40°C). It features a maximum voltage of just 3.7V, a maximum current of just 1.4A, a maximum cooling power of just 5W, and an internal resistance of 2.06Ω.

Its 12×12mm package—the world’s smallest—allows it to be easily integrated into ultra-compact spaces such as smartphone camera modules, miniature optical modules, wearable sensors, and endoscope probes. Compared to the 15×15mm version, the package area has been further reduced by 36% (from 225mm² to 144mm²), while electrical performance (3.7V/1.4A/5W/70°C) remains completely consistent. This means that the world’s leading ultra-low-power cooling capability and 70°C deep-cooling performance have been condensed into the world’s smallest package volume, achieving the ultimate cooling power density per unit volume.

This product utilizes a 96% alumina ceramic substrate and a 0.2mm oxygen-free copper sintering process, achieving extreme lightweight design while ensuring excellent thermal conductivity and electrical insulation. With a substrate thickness of just 0.76mm and a copper layer of only 0.2mm, the overall weight is extremely light, thermal capacity is minimal, and temperature response is extremely fast. It comes standard with 26 AWG ultra-soft silicone rubber leads (100 mm in length). The leads are extremely flexible and exert virtually no mechanical stress on the micro-chiller, making them ideal for precision mounting. The 704 silicone rubber perimeter seal provides excellent moisture, dust, and shock resistance, enabling the unit to operate in complex environments with high humidity and significant temperature fluctuations. The all-solid-state design ensures precision operation with zero noise and zero vibration, making it suitable for high-precision applications with the most stringent requirements for noise and vibration. With an extremely low power consumption of 5W, it can be powered directly by a single lithium battery for several hours without any boost circuit, making it the ideal temperature control core for ultra-portable devices powered by coin cells or micro lithium batteries.

🔷Thermoelectric Peltier Module Operation Principle

TEC1-03101 utilizes the Peltier effect to achieve thermoelectric cooling. At its core, multiple pairs of P-type (Bi₂Te₃-Sb₂Te₃ hole-type) and N-type (Bi₂Te₃-Bi₂Se₃ electron-type) semiconductor grains are connected in series via metal bus bars to form a thermoelectric stack, which is sandwiched between two layers of highly thermally conductive 96% alumina ceramic substrates. The oxygen-free copper layer is only 0.2 mm thick, effectively reducing thermal capacity and weight, resulting in a more responsive temperature response.

When a forward DC voltage (up to 3.7 V) is applied, a 1.4 A current drives the holes in the P-type material and the electrons in the N-type material to migrate in opposite directions. As the charge carriers cross the PN junction interface, the cold junction absorbs lattice vibration energy (phonons), causing the temperature to drop, while the hot junction releases energy, causing the temperature to rise. Under continuous electric field drive, heat is continuously “pumped” from the cold end to the hot end, achieving active cooling.

This product achieves a maximum temperature difference of 70°C (K22 model) when the hot-end temperature is 40°C, meaning the cold end can reach as low as approximately -30°C. Achieving such deep cooling with an ultra-low input power of just 5W demonstrates exceptional energy efficiency. Due to its extremely low power consumption, the device generates very little heat on its own and requires minimal cooling—in most applications, a miniature heat sink or even just the thermal radiation from the cooling plate’s own substrate is sufficient to meet heat dissipation needs, providing a viable temperature control solution for enclosed micro-devices where fans or heat sinks cannot be installed.

🔷Cooling Module Installation and Usage Recommendations

Assembly Pressure: Recommended 0.5 kg (0.25 kg/cm²). It is recommended to apply thermal grease (thermal conductivity > 3 W/m·K) evenly to both surfaces, with a thickness of 0.05–0.1 mm.

Heat Sink Requirements for the Hot End: With an extremely low power consumption of 5 W, in most scenarios, a small 15 × 15 × 10 mm heat sink is sufficient—or even no active cooling is required, as natural convection is adequate.

Power Supply Requirements: Maximum voltage 3.7 V, maximum current 1.4 A; can be powered directly by a single lithium battery. For stable temperature control, we recommend using an LDO with a rating of 3.7 V/2 A or higher.

Lead Wires: Comes standard with 26 AWG silicone-coated wires, which fully meet the 1.4 A requirement; no replacement is necessary.

Current Limit: Do not exceed 1.4A; it is recommended to connect a 1.5A self-resetting fuse in series for overcurrent protection.

Condensation Prevention Measures: During deep cooling (cold end < 0°C), fill the area around the cold end with desiccant or add insulation, and apply conformal coating to the lead solder joints.

Storage Conditions: Temperature < 120°C, humidity < 60% Rh; packaged in a sealed bag with desiccant.

Maximum Temperature: Must not exceed the solder melting point of 138°C; when soldering manually, keep the soldering iron temperature below 280°C, and limit soldering time to < 5 seconds.