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Product Brief Description The 30×6×3.3mm miniature semiconductor cooling plate is compact, ultra-thin, and easy to install. It operates quietly, consumes minimal power, and provides precise temperature control, making it ideal for constant-temperature cooling applications in small, precision devices such as optical modules, beauty devices, portable medical equipment, and VR cooling systems. 🟧 Price List Contact Customer Service 🟦 Product PDF Spec Contact Customer Service ⬜ Certifications Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory：Online Factory Video 🟫 Multiple Payment Methods：T/T|PayPal|Alipay ⬛ Pre|After Service：+86 13377785035|xyy@kkg.tw
🔷30*6*3.3mm Peltier Cooler's Drawing
🔷TEC Cooler's Product Structure
A semiconductor cooling plate is like a sandwich cookie, consisting of three layers:
Top layer: ceramic substrate (cold side / cold end)
Middle layer: P-N semiconductor array + copper heat spreader
Bottom layer: ceramic substrate (hot side / hot end)
🔷Work Principle of Mini Peltier Module 30*6mm
Based on the Peltier effect, when a direct current is applied to a cooling plate composed of P-type and N-type semiconductors, heat transfer occurs as the current flows through the semiconductor junction. One end absorbs heat to form a cold surface, achieving cooling, while the other end releases heat to form a hot surface. By reversing the polarity of the power supply, the hot and cold sides can be switched. Cooling is achieved through heat transfer, without the need for refrigerants or mechanical movement.
🔷Peltiers' Product Parameter
| Parameter | Th = 25°C | Th = 50°C | Description |
| Hot side temperature Th | 25°C | 50°C | Hot side temperature during operation or testing |
| Maximum cooling capacity Qcmax (W) | 5.7 | 6.1 | Cooling capacity when ΔT=0 and I=Imax |
| Maximum temperature difference ΔTmax (°C) | 66.0 | 70.0 | Temperature difference when Qc=0 and I=Imax |
| Maximum current Imax (A) | 2.7 | 2.7 | Current when ΔT=ΔTmax or Qc=Qcmax |
| Maximum voltage Umax (V) | 3.8 | 4.1 | Voltage when ΔT=ΔTmax and I=Imax |
| AC resistance (1kHz) (Ω) | 1.11 | 1.22 | AC resistance of the device at the specified temperature |
| Performance tolerance | ±12% | ±12% | Quality control standard for product shipment |
🔷Peltier Module Cooler's Model Selection
| Model No. | Thermocouple Pairs | L*W (mm) | H (mm) | Umax (V) | Imax (A) | Qcmax (W) |
| TES1-031 | 31 | 30*6 | 2.98±0.1 | 3.5 | 4.1 | 8.67 |
| TES1-031 | 31 | 30*6 | 2.98±0.1 | 3.5 | 2.6 | 5.55 |
| TES1-031 | 31 | 30*6 | 3.25±0.1 | 3.5 | 3.37 | 7.13 |
| TES1-031 | 31 | 30*6 | 3.25±0.1 | 3.5 | 2.16 | 4.56 |
| TES1-031 | 31 | 30*6 | 3.40±0.1 | 3.5 | 3.07 | 6.49 |
| TES1-031 | 31 | 30*6 | 3.53±0.1 | 3.6 | 2.85 | 6.05 |
| TES1-035 | 35 | 30*6 | 2.98±0.1 | 3.98 | 2.62 | 6.26 |
| TES1-035 | 35 | 30*6 | 2.98±0.1 | 3.98 | 4.1 | 9.79 |
| TES1-035 | 35 | 30*6 | 3.25±0.1 | 3.98 | 2.16 | 5.15 |
| TES1-035 | 35 | 30*6 | 3.25±0.1 | 3.98 | 3.3 | 8.05 |
| TES1-035 | 35 | 30*6 | 3.13±0.1 | 3.98 | 3.66 | 8.74 |
| TES1-035 | 35 | 30*6 | 3.53±0.1 | 3.98 | 2.85 | 6.84 |
| TES1-035 | 35 | 30*7 | 2.98±0.1 | 3.98 | 2.62 | 6.26 |
| TES1-035 | 35 | 30*7 | 2.98±0.1 | 3.98 | 4.1 | 9.79 |
| TES1-031 | 31 | 30*8 | 4.32±0.1 | 3.5 | 3.38 | 7.14 |
| TES1-071 | 71 | 30*8 | 2.98±0.1 | 8.08 | 2.27 | 11.03 |
| TES1-120 | 120 | 30*8 | 3.25±0.1 | 13.57 | 1.58 | 12.06 |
| TES1-064 | 64 | 40*8 | 2.98±0.1 | 7.27 | 2.62 | 11.46 |
| TES1-018 | 18 | 10*10 | 3.1±0.1 | 2.04 | 4.46 | 5.34 |
| TES1-018 | 18 | 10*10 | 3.28±0.1 | 2.04 | 4.04 | 4.92 |
| TES1-018 | 18 | 10*10 | 3.46±0.1 | 2.04 | 3.32 | 4.06 |
| TES1-035 | 35 | 12*12 | 3.25±0.1 | 4.2 | 1.28 | 3.14 |
| TES1-035 | 35 | 12*12 | 3.58±0.1 | 4.2 | 1.21 | 2.99 |
| TES1-049 | 49 | 15*15 | 3.19±0.1 | 5.88 | 2.62 | 8.77 |
| TES1-031 | 31 | 15*15 | 3.25±0.1 | 3.72 | 3.37 | 11.2 |
🔷Peltier Device Cooler's Product Feature
Ultra-compact size: 30×6×3.3mm, minimal footprint for tight integration.
Thin profile: 3.3mm thickness, low thermal resistance, fast response.
High-performance Bi₂Te₃ thermoelectric material: High cooling efficiency.
Ceramic substrate (Al₂O₃/AlN): Excellent insulation and thermal conductivity.
Sealed construction: Silicone RTV sealed, moisture-proof, long lifespan.
Low voltage: 3.8–5.9V, compatible with 5V/12V systems.
High ΔT: Max temperature difference ≥65℃.
Fast cooling: Millisecond-level response, precise temp control (±0.01℃).
No noise, no vibration: Solid-state operation.
Eco-friendly: RoHS/REACH compliant, no refrigerants.
🔷Cooler with Peltier's Performance Curve
🔷Peltier Module Cooler's Application
1. Temperature control for optical modules and laser diodes
2. Cooling for micro-sensors and infrared detectors
3. Portable medical devices and beauty devices
4. Heat dissipation for smartphones, tablets, and VR headsets
5. Temperature-controlled chambers for small precision instruments
🔷Precautions for Using TEC Cooling Plates
1. Hot/Cold Side Check
▪ Red wire = positive (+), black wire = negative (-).
▪ Power on briefly (≤3 seconds) without heat sink:
▪ Warm side = hot side; cool side = cold side.
⚠️ Do not exceed 3 seconds (risk of burnout).
2. Wiring & Power
▪ Red = positive (cooling), reverse polarity for heating.
▪ Use power supply with ripple < 10%.
3. Voltage Calculation
▪ Model example: TEC1-12706
▪ 127 = thermocouple count; 06 = max current (A).
▪ Limit voltage = count × 0.12 (127×0.12=15.4V).
▪ Working voltage = 78% of limit (15.4×0.78=12.01V).
4. Thermal Recovery
▪ Wait ≥15 minutes for TEC to return to room temperature before reuse.
5. Sealing
▪ Seal edges with 704 silicone or epoxy to prevent moisture and extend life.
6. Installation
▪ Clean TEC, heat sink, cold plate; apply thin thermal grease.
▪ Tighten screws evenly; fill gap with 25–30mm insulation.
7. Pressure
▪ Install pressure: 150–300 PSI (avoid too low/high pressure).
8. Resistance Test
▪ Test resistance with LCR meter/compensated ohmmeter.
▪ Multimeter readings are only for reference.
Yanghai Technology has been deeply rooted in the thermoelectric cooling industry for over a decade. As a comprehensive enterprise integrating R&D, manufacturing, sales, and service, the company places technological innovation at its core and continuously advances into cutting-edge industry applications.
We provide global customers with highly reliable, cost-effective thermoelectric cooling products and solutions, and are committed to becoming a trusted partner in the industry.
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