TEC1-04925 High Temperature Thermoelectric Module 40*40mm

TEC1-04925 40*40mm high temperature thermoelectric module for industrial cooling, laser cooling, semiconductor temperature control and precision thermal management.
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🟨 MOQ:1 Pcs
🟥 Fast Delivery:2-15 Days
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🔷Product Drawing





🔷Basic Performance Spec

Type modelIn APE▲Tmax(°C)ACRohm(Ω)Umax(V)Imax(A)Pmax(W)Size(mm)
TEC1-04925K12600.185.82514540x40x3.6
K14650.185.82514540x40x3.8
K16700.185.82514540x40x4.0




🔷Additional Performance Spec

ParameterSpecification
Substrate Specification96% Alumina 0.76 + Oxygen-free Copper 0.4 sintering process
Wire SpecificationUltra-soft silicone wire 18AWG / L=200mm (Double wire)
Terminal SpecificationStandard product has no terminals; can be added upon request
Assembly Pressure4kg / (0.25kg/CM²)
Packaging StandardPolystyrene (PS) foam box packaging
Sealing Material704 silicone rubber seal
Maximum Temperature ResistanceTin-bismuth environmental solder, melting point 138°C
Storage EnvironmentTemperature < 120°C, Humidity < 60%Rh




🔷Performance Curve




🔷Product Overview

The TEC1-04925 Thermoelectric Cooler 40*40mm is a compact Peltier-based thermoelectric cooling module designed for applications requiring localized cooling and precise temperature control.

As one type of high temperature thermoelectric module, it can be considered for thermal management systems where conventional cooling methods may have limitations. By applying DC power, the module transfers heat from one side to the other, creating a cold side and a hot side.

With its 40*40mm form factor, the module can be integrated into compact thermal systems for industrial equipment, electronic devices, laboratory instruments and other temperature-sensitive applications.

Depending on the system design and operating conditions, the module can be used for high temperature thermoelectric cooling, localized cooling and precision temperature regulation.

For applications involving elevated temperatures, engineers should select the module according to the actual hot-side temperature, thermal load, required temperature difference and heat dissipation conditions.




🔷Product Features

1. Compact 40*40mm Design

The 40*40mm form factor provides a compact solution for thermoelectric cooling systems with limited installation space.

2. Peltier Thermoelectric Cooling

The module uses the Peltier effect to transfer heat from the cold side to the hot side without mechanical moving parts.

3. Suitable for Temperature Control

The module can be integrated with temperature sensors and controllers for applications requiring controlled cooling and thermal regulation.

4. High Temperature Application Potential

The TEC1-04925 can be considered for high temperature thermoelectric module applications when the module specifications and system operating conditions are properly matched.

5. Easy System Integration

The compact structure allows the module to be incorporated into custom heat sinks, cold plates, cooling assemblies and temperature control systems.

6. Localized Thermal Management

Thermoelectric technology enables targeted cooling of specific components, making it useful for applications where localized temperature control is required.



🔷Product Applications

High Temperature Thermoelectric Module for Industrial Cooling

The TEC1-04925 can be integrated into industrial thermal management systems where localized cooling and temperature regulation are required.

High Temperature Thermoelectric Module for Laser Cooling

Thermoelectric cooling modules can be used for thermal management of laser-related components where stable temperature control is important for system operation.

High Temperature TEC Module for Semiconductor Cooling

The module can be considered for semiconductor and electronic component temperature control systems, particularly where compact localized cooling is required.

High Temperature Peltier Module for Temperature Control

The TEC1-04925 can work with temperature sensors and controllers to provide active heating or cooling for precision thermal management systems.

High Temperature Thermoelectric Cooling for Industrial Equipment

Thermoelectric modules can provide localized cooling for industrial equipment without requiring conventional refrigerants or mechanically moving compressor components.

High Temperature TEC Cooling for Electronics

The compact 40*40mm design can be integrated into electronic equipment for localized heat management of temperature-sensitive components.

High Temperature Thermoelectric Module for Laboratory Equipment

Thermoelectric technology can be used in laboratory instruments requiring controlled and repeatable temperature regulation.

High Temperature Peltier Cooling for Precision Temperature Control

The module can be combined with a closed-loop control system to achieve controlled cooling for precision temperature management applications.




🔷Product Structure




🔷Operation Principle / Work Principle

The TEC1-04925 Thermoelectric Cooler operates according to the Peltier effect.

When direct current passes through the semiconductor thermoelectric elements, heat is absorbed on one side of the module and released on the opposite side. This creates a temperature difference between the two ceramic surfaces.

The basic cooling process is:

DC Power → Semiconductor Elements → Heat Absorption → Heat Transfer → Heat Dissipation

The cold side absorbs heat from the target component, while the hot side transfers the absorbed heat and electrical heat to a heat sink, cold plate or other thermal dissipation system.

For a practical high temperature thermoelectric module application, the hot-side heat dissipation system is particularly important. If the hot side cannot effectively remove heat, the temperature difference and cooling performance will be reduced.

Therefore, the complete system should be designed around:

Thermoelectric Module + Thermal Interface + Heat Sink + Temperature Sensor + Controller

This makes thermoelectric technology suitable for localized and precision temperature control in industrial, electronic, laser, semiconductor and laboratory equipment.




🔷FAQ

Q1: What is TEC1-04925?

TEC1-04925 is a 40*40mm thermoelectric cooler based on Peltier thermoelectric technology. It is designed for active cooling and temperature control applications.

Q2: Can TEC1-04925 be used as a high temperature thermoelectric module?

TEC1-04925 can be considered for high-temperature thermoelectric applications, but the actual suitability depends on the required hot-side temperature, cooling load, operating current, heat dissipation conditions and module specifications.

Q3: What applications can use this high temperature TEC module?

Potential applications include industrial cooling, laser cooling, semiconductor temperature control, electronic equipment cooling, laboratory equipment and precision temperature control systems.

Q4: Can this thermoelectric module be used for laser cooling?

Yes, thermoelectric cooling technology can be used for laser thermal management. The specific TEC1-04925 selection should be verified according to the laser's heat load and required operating temperature.

Q5: Can it be used for semiconductor cooling?

Yes. Thermoelectric modules are commonly considered for localized semiconductor temperature control. The module's cooling capacity and operating conditions should be matched with the semiconductor heat load.

Q6: Is TEC1-04925 suitable for industrial equipment?

The compact 40*40mm structure makes it suitable for integration into various industrial thermal management systems. Actual suitability depends on the equipment's thermal load and operating environment.

Q7: How should I select a thermoelectric module for high-temperature applications?

Engineers should consider hot-side temperature, cooling capacity, required temperature difference, operating current, voltage, heat dissipation performance and installation space together.

Q8: Can you provide customized high temperature thermoelectric modules?

Customized thermoelectric modules can be developed according to requirements such as module dimensions, electrical characteristics, wire specifications, operating temperature, cooling capacity and application environment.

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