TEC1-04925 40*40mm high temperature thermoelectric module for industrial cooling, laser cooling, semiconductor temperature control and precision thermal management. 🟧 Price List Contact Customer Service 🟦 Product Spec Contact Customer Service ⬜ Certifications Contact Customer Service 🟪 Contact customer Contact Customer Service 🟨 MOQ:1 Pcs 🟥 Fast Delivery:2-15 Days 🟩 Source Factory:Online Factory Video 🟫 Multiple Payment Methods:T/T|PayPal|Alipay ⬛ Pre|After Service:+86 13377785035|xyy@kkg.tw

| Type model | In APE | ▲Tmax(°C) | ACRohm(Ω) | Umax(V) | Imax(A) | Pmax(W) | Size(mm) |
|---|---|---|---|---|---|---|---|
| TEC1-04925 | K12 | 60 | 0.18 | 5.8 | 25 | 145 | 40x40x3.6 |
| K14 | 65 | 0.18 | 5.8 | 25 | 145 | 40x40x3.8 | |
| K16 | 70 | 0.18 | 5.8 | 25 | 145 | 40x40x4.0 |
| Parameter | Specification |
|---|---|
| Substrate Specification | 96% Alumina 0.76 + Oxygen-free Copper 0.4 sintering process |
| Wire Specification | Ultra-soft silicone wire 18AWG / L=200mm (Double wire) |
| Terminal Specification | Standard product has no terminals; can be added upon request |
| Assembly Pressure | 4kg / (0.25kg/CM²) |
| Packaging Standard | Polystyrene (PS) foam box packaging |
| Sealing Material | 704 silicone rubber seal |
| Maximum Temperature Resistance | Tin-bismuth environmental solder, melting point 138°C |
| Storage Environment | Temperature < 120°C, Humidity < 60%Rh |

The TEC1-04925 Thermoelectric Cooler 40*40mm is a compact Peltier-based thermoelectric cooling module designed for applications requiring localized cooling and precise temperature control.
As one type of high temperature thermoelectric module, it can be considered for thermal management systems where conventional cooling methods may have limitations. By applying DC power, the module transfers heat from one side to the other, creating a cold side and a hot side.
With its 40*40mm form factor, the module can be integrated into compact thermal systems for industrial equipment, electronic devices, laboratory instruments and other temperature-sensitive applications.
Depending on the system design and operating conditions, the module can be used for high temperature thermoelectric cooling, localized cooling and precision temperature regulation.
For applications involving elevated temperatures, engineers should select the module according to the actual hot-side temperature, thermal load, required temperature difference and heat dissipation conditions.
The 40*40mm form factor provides a compact solution for thermoelectric cooling systems with limited installation space.
The module uses the Peltier effect to transfer heat from the cold side to the hot side without mechanical moving parts.
The module can be integrated with temperature sensors and controllers for applications requiring controlled cooling and thermal regulation.
The TEC1-04925 can be considered for high temperature thermoelectric module applications when the module specifications and system operating conditions are properly matched.
The compact structure allows the module to be incorporated into custom heat sinks, cold plates, cooling assemblies and temperature control systems.
Thermoelectric technology enables targeted cooling of specific components, making it useful for applications where localized temperature control is required.
The TEC1-04925 can be integrated into industrial thermal management systems where localized cooling and temperature regulation are required.
Thermoelectric cooling modules can be used for thermal management of laser-related components where stable temperature control is important for system operation.
The module can be considered for semiconductor and electronic component temperature control systems, particularly where compact localized cooling is required.
The TEC1-04925 can work with temperature sensors and controllers to provide active heating or cooling for precision thermal management systems.
Thermoelectric modules can provide localized cooling for industrial equipment without requiring conventional refrigerants or mechanically moving compressor components.
The compact 40*40mm design can be integrated into electronic equipment for localized heat management of temperature-sensitive components.
Thermoelectric technology can be used in laboratory instruments requiring controlled and repeatable temperature regulation.
The module can be combined with a closed-loop control system to achieve controlled cooling for precision temperature management applications.

The TEC1-04925 Thermoelectric Cooler operates according to the Peltier effect.
When direct current passes through the semiconductor thermoelectric elements, heat is absorbed on one side of the module and released on the opposite side. This creates a temperature difference between the two ceramic surfaces.
The basic cooling process is:
DC Power → Semiconductor Elements → Heat Absorption → Heat Transfer → Heat Dissipation
The cold side absorbs heat from the target component, while the hot side transfers the absorbed heat and electrical heat to a heat sink, cold plate or other thermal dissipation system.
For a practical high temperature thermoelectric module application, the hot-side heat dissipation system is particularly important. If the hot side cannot effectively remove heat, the temperature difference and cooling performance will be reduced.
Therefore, the complete system should be designed around:
Thermoelectric Module + Thermal Interface + Heat Sink + Temperature Sensor + Controller
This makes thermoelectric technology suitable for localized and precision temperature control in industrial, electronic, laser, semiconductor and laboratory equipment.
TEC1-04925 is a 40*40mm thermoelectric cooler based on Peltier thermoelectric technology. It is designed for active cooling and temperature control applications.
TEC1-04925 can be considered for high-temperature thermoelectric applications, but the actual suitability depends on the required hot-side temperature, cooling load, operating current, heat dissipation conditions and module specifications.
Potential applications include industrial cooling, laser cooling, semiconductor temperature control, electronic equipment cooling, laboratory equipment and precision temperature control systems.
Yes, thermoelectric cooling technology can be used for laser thermal management. The specific TEC1-04925 selection should be verified according to the laser's heat load and required operating temperature.
Yes. Thermoelectric modules are commonly considered for localized semiconductor temperature control. The module's cooling capacity and operating conditions should be matched with the semiconductor heat load.
The compact 40*40mm structure makes it suitable for integration into various industrial thermal management systems. Actual suitability depends on the equipment's thermal load and operating environment.
Engineers should consider hot-side temperature, cooling capacity, required temperature difference, operating current, voltage, heat dissipation performance and installation space together.
Customized thermoelectric modules can be developed according to requirements such as module dimensions, electrical characteristics, wire specifications, operating temperature, cooling capacity and application environment.
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