🔷TEC Product's Parameters

🔷Thermoelectric Cooling Module's Component Composition

-Semiconductor Cooler: As the core component of the cooling module, it utilizes the Peltier effect of semiconductor materials to achieve cooling. It features no moving parts, silent operation, and high reliability.

-Heat Pad: Located on one side of the semiconductor cooler, it facilitates heat conduction. It evenly transfers the cooling generated by the semiconductor cooler to the surface of the object requiring cooling, enhancing cooling efficiency.

-Heat Sink: Typically constructed from highly thermally conductive materials with densely packed fins, it rapidly dissipates heat generated on the opposite side of the semiconductor cooler into the surrounding environment, ensuring sustained and stable operation of the cooling module.

-Compact Fan: Assists the heat sink in dissipation by accelerating airflow through forced convection, further enhancing thermal efficiency and guaranteeing stable module performance under high-load conditions.

🔷Paltier Refrigerator's Feature

1. High-Efficiency Cooling Capability: This module delivers “Challenge minus 50°” cooling performance, achieving significant temperature reduction in diverse complex environments.

2. Diverse Specifications: Multiple specifications are available to accommodate the thermal management needs of various equipment. Whether for compact devices with limited space or large-scale systems demanding high thermal performance, suitable configurations can be found.

3. Highly Customizable: Supports tailored solutions, allowing adjustments to the module's structure and performance parameters based on specific customer requirements to ensure seamless integration with client equipment.

🔷Semiconductor Heat Sink's Application

This cooling module is suitable for a wide range of applications, including electronic equipment cooling (such as high-performance computers, servers, laser equipment, etc.), medical device temperature control, and laboratory instrument cooling. It effectively addresses equipment heat dissipation issues, ensuring normal operation and stable performance.

🔷Precautions for Using TEC Cooling Plates

1. Hot/Cold Side Check

▪ Red wire = positive (+), black wire = negative (-).

▪ Power on briefly (≤3 seconds) without heat sink:

▪ Warm side = hot side; cool side = cold side.

⚠️ Do not exceed 3 seconds (risk of burnout).

2. Wiring & Power

▪ Red = positive (cooling), reverse polarity for heating.

▪ Use power supply with ripple < 10%.

3. Voltage Calculation

▪ Model example: TEC1-12706

▪ 127 = thermocouple count; 06 = max current (A).

▪ Limit voltage = count × 0.12 (127×0.12=15.4V).

▪ Working voltage = 78% of limit (15.4×0.78=12.01V).

4. Thermal Recovery

▪ Wait ≥15 minutes for TEC to return to room temperature before reuse.

5. Sealing

▪ Seal edges with 704 silicone or epoxy to prevent moisture and extend life.

6. Installation

▪ Clean TEC, heat sink, cold plate; apply thin thermal grease.

▪ Tighten screws evenly; fill gap with 25–30mm insulation.

7. Pressure

▪ Install pressure: 150–300 PSI (avoid too low/high pressure).

8. Resistance Test

▪ Test resistance with LCR meter/compensated ohmmeter.

▪ Multimeter readings are only for reference.